The ability to predict, in the design stage, how a product will perform in its operating environment is not only an invaluable aid but, in an increasingly competitive marketplace, an economic ...

Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...

As manufacturers struggle to keep up with demands for smaller, faster, more power-efficient high-performance electronics, one solution from Ansys and Microsoft provides relief. As wireless ...

The advanced technology behind ANSYS 14.0 includes hundreds of new, advanced features that make it easier, faster and less costly for organizations to bring new products to market. The framework for ...

Laminated fiber-reinforced composite materials are being used in more and more engineering applications. These materials have excellent strength-to-weight ratios and the manufacturing processes that ...